Description
Advanced Solder Paste Inspection for SMT Processes
The MIRTEC MS-15 is a flagship solution for high-resolution 3D solder paste inspection, specifically designed to meet the rigorous demands of advanced SMT and semiconductor manufacturing processes. Its outstanding precision ensures consistent quality and reliability in your production line.
State-of-the-Art Technology
Equipped with cutting-edge technology, the MIRTEC MS-15 delivers unparalleled performance in detecting and analyzing solder paste deposits. Its inline 3D inspection capabilities provide comprehensive data, empowering manufacturers to optimize production workflows and meet stringent quality standards.
Designed for Modern Manufacturing
This system is tailored for high-volume production environments, offering seamless integration into existing SMT setups. With the MIRTEC MS-15, manufacturers benefit from increased efficiency, enhanced product reliability, and reduced production defects.
Key Features & Specifications
- High-Resolution Imaging: Equipped with a 25-megapixel CoaXPress (CXP) high-resolution camera and precision telecentric lens options (4 µm / 6 µm) for superior measurement stability and image clarity.
- Precision Measurement: Accurately measures solder paste height, area, volume, bridging, shape deformity, and X-Y position.
- Ultra-Small Component Support: Capable of inspecting micro-pads down to 0201 mm sizes (such as mini-LED chips) with high repeatability at maximum throughput.
- Dual Linear Motor Drive: Uses a dual linear motor drive system to deliver semiconductor-level repeatability and fast inspection speeds.
- PCB Warpage Compensation: Features real-time diagnostics to detect, compensate for, and flag warped or twisted printed circuit boards.
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