Description
Advanced Technology for Solder Paste Inspection
The MIRTEC MS-11e offers cutting-edge performance in 3D inline Solder Paste Inspection, designed to meet the exacting demands of SMT printed circuit board manufacturing. Its advanced capabilities ensure precise inspection of solder paste application, significantly enhancing production quality.
Engineered for High Accuracy
Built with precision in mind, the MS-11e is equipped to detect even the most minor inconsistencies in solder deposition. This ensures optimal functionality of SMT assemblies, minimizing defects and rework in your manufacturing process.
Your Reliable Partner in SMT Manufacturing
Whether you need to meet strict industry standards or streamline your production line, the MIRTEC MS-11e combines reliability with performance. Optimize your PCB manufacturing process and deliver consistent quality with this state-of-the-art SPI system.
Key Features & Technology
- Camera System: Uses an exclusive 15-megapixel CoaXPress vision system for high-speed, high-resolution image transfer.
- 3D Imaging: Features Dual Projection Shadow-Free Moiré Phase Shift Imaging technology to prevent shadows and accurately measure solder paste.
- AI Software: Utilizes artificial intelligence and deep learning for automatic programming, reducing human error and improving optical character recognition (OCR).
- Warpage Compensation: Features laser PCB warpage compensation to handle bent or warped boards during inspection.
Technical Specifications
- Height Resolution: 0.1 µm
- Height Accuracy: 2 µm
- PCB Size Range: 50 mm x 50 mm up to 510 mm x 460 mm
- Measurement Capabilities: Volume, area, height, X-Y position, bridging, and shape deformity.
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