Description
Unparalleled Precision in Solder Paste Inspection
The KY8030-2 is an industry-leading True 3D Solder Paste Inspection (SPI) system designed to enhance the efficiency and accuracy of your SMT (Surface Mount Technology) printed circuit board assembly lines. Manufactured by the trusted Koh Young, this is a best-selling solution for ensuring optimal solder paste application, reducing errors, and improving production quality.
Reliable Performance for High-Speed Manufacturing
Engineered with cutting-edge True 3D inspection technology, the KY8030-2 offers unparalleled reliability even in the most fast-paced SMT environments. Its high-speed inspection capabilities enable seamless integration into your production line, ensuring consistent results without compromising throughput.
Why Choose the KY8030-2?
This premium SPI system excels in optimizing stencil printing processes for superior outcomes. Whether you’re seeking to minimize defects or enhance product quality, the KY8030-2 is the trusted solution for elevating your production standards.
Key Features
- Dual-Projection Moiré Technology: Uses patented 3D dual-projection Moiré technology to prevent shadow effects and specular reflection issues on complex boards.
- Real-Time Warp Compensation: Features Z-tracking 3D compensation to actively measure and adjust for substrate warpage, bow, twist, and slope.
- AI-Powered Optimization: Integrates with the Koh Young Process Optimizer (KPO) and KSMART software for smart process control and printer optimization.
- Optional Auto-Dispensing: Offers automated solder paste dispensing and auto-rework capabilities to fix insufficient joints and reduce scrap.
Specifications
- Max Inspection Speed: Up to 56.1–80 cm²/sec depending on configuration.
- Inspection Range: Down to 01005 component sizes.
- Max PCB Size: Up to 490 × 510 mm or 510 × 510 mm variants.
- Machine Dimensions: Approximately 1000 × 1280 × 1727 mm.
- Weight: Around 600 kg
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