Koh Young aSPIre 3 | Industry Highest Performing 3D SPI

Description

Unmatched 3D Solder Paste Inspection

The Koh Young aSPIre 3 is a cutting-edge 3D solder paste inspection (SPI) system designed to meet the rigorous requirements of modern electronics and advanced semiconductor packaging industries. It delivers precise volumetric measurements to ensure the highest level of quality in PCB manufacturing.

Eliminate Print Defects with Ease

Optimize your production processes effortlessly with the aSPIre 3’s advanced process optimization capabilities. By early detection and prevention of print defects, this system enhances yield and ensures unparalleled reliability in complex manufacturing scenarios.

Engineered for Excellence

Built for performance, the Koh Young aSPIre 3 is equipped with metrology-grade technology to provide consistent and dependable results. Trust this innovative solution to elevate your production quality and keep ahead in a competitive industry.

Key Features

The Highest Standard in Metrology-level 3D Inspection

The aSPIre 3 incorporates proprietary and multi-direction projection technology delivering outstanding accuracy and repeatability required to measure the emerging 03015M components used in high-volume production. Furthermore, the aSPIre 3 sets a higher standard in metrology-level 3D inspection by overcoming inspection challenges like shadow and specular reflection, as well as board warp and non-linear challenges.

Beyond Solder Paste Inspection

Active Warp Compensation

Self-Diagnosis for Optimal Performance

KSMART Solutions: True 3D Measurement-based Process Control System

Zero-defect through AI-Powered Koh Young Process Optimizer (KPO) Printer

The Koh Young aSPIre 3 is an industry-leading metrology-grade 3D solder paste inspection (SPI) system engineered for demanding electronics and advanced semiconductor packaging applications.

It delivers precise volumetric measurements and advanced process optimization to eliminate print defects. Key specifications and features include:

• High-Precision Metrology: Measures deposits down to 0.37 µm Z-resolution with 1 µm height accuracy and a Gage R&R under 10% at 6 sigma, supporting ultra-fine components down to 03015 metric.
• AI-Powered Optimization: Integrates the Koh Young Process Optimizer (KPO) to autonomously analyze print data and real-time variables, adjusting the printer parameters without manual expert intervention.
• Advanced Board Warpage Compensation: Employs real-time Z-tracking and Pad-referencing 2D/3D compensation to maintain measurement stability across warped, twisted, or bowed substrates.
• Predictive Self-Diagnosis: Features internal diagnostic modules that perform routine checks on optics, laser intensity, and height accuracy to prevent unscheduled line downtime.
• Beyond Paste Inspection: Capable of inspecting conductive adhesives, sintered silver paste, and whole-board foreign material (WFMI) with full-color map outputs.