Description
Key Features & Benefits
- High-Speed Placement: Achieves a placement speed of 80,000 CPH (Optimum) with its 2 Gantry x 10 Spindles configuration.
- Exceptional Accuracy: Delivers precise placement with ±40µm accuracy (Cpk≥1.0) for 0402 (01005 inch) chips and ±30µm accuracy (Cpk≥1.0) for ICs using stage vision.
- Broad Component Handling:
- Fly Camera: Handles components from 0402 to □16 mm.
- Fix Camera: Supports larger components up to □42 mm (Standard), □55 mm (MFOV), and connectors up to L75 mm (MFOV). Supports a maximum component height of 12 mm (Fly) and 25 mm (Fix).
- Advanced Recognition: Reinforces odd-shape component recognition by applying a 3D lighting system, which also prevents reverse insertion by recognizing the polarity mark on the component’s bottom surface.
- Flexible Conveyor System: Supports a modular conveyor system (Shuttle ↔ Dual) for various production environments and features a Dual Lane PCB Transfer System. This allows for zero PCB loading/unloading time by pre-loading the opposite lane, increasing productivity by up to 15% compared to a single lane.
Technical Specifications
| Specification | Detail |
| Alignment | Fly Camera, Fix Camera |
| Spindle & Speed | 2 Gantry * 10 Spindles / 80,000 CPH (Optimum) |
| Placement Accuracy | Chip: ±40µm @ Cpk≥1.0 (0402 chip) IC: ±30µm @ Cpk≥1.0 (Stage Vision) |
| Component Range | Fly: 0402 ~ □16 mm Fix: ~□42 mm (Standard) / ~□55 mm (MFOV) / ~L75 mm Connector (MFOV) |
| Max. Component Height | 12 mm (Fly) / 25 mm (Fix) |
| PCB Size (Max) | Single Lane: L510 x W460 mm (Standard), up to L1,500 x W460 mm (Option) Dual Lane: L510 x W250 mm (Standard), up to L1,200 x W250 mm (Option) |
| Feeder Capacity | 120 ea (8 mm standard) / 112 ea (Docking Cart) |
| Power | 3 Phase, AC 200/208/220/240/380/415V ±10% (50/60Hz), Max. 5.0 kVA |
| Air Consumption | 5.0 ~ 7.0 kgf/cm², 50 Nℓ/min |
| External Dimension | L 1,430 x D 1,740 x H 1,485 mm |
| Weight | Approx. 1,800 kg |
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