Key Features & Benefits

High-Speed Placement: Achieves a placement speed of 80,000 CPH (Optimum) with its 2 Gantry x 10 Spindles configuration.
Exceptional Accuracy: Delivers precise placement with ±40µm accuracy (Cpk≥1.0) for 0402 (01005 inch) chips and ±30µm accuracy (Cpk≥1.0) for ICs using stage vision.
Broad Component Handling:
- Fly Camera: Handles components from 0402 to □16 mm.
- Fix Camera: Supports larger components up to □42 mm (Standard), □55 mm (MFOV), and connectors up to L75 mm (MFOV). Supports a maximum component height of 12 mm (Fly) and 25 mm (Fix).
Advanced Recognition: Reinforces odd-shape component recognition by applying a 3D lighting system, which also prevents reverse insertion by recognizing the polarity mark on the component’s bottom surface.
Flexible Conveyor System: Supports a modular conveyor system (Shuttle ↔ Dual) for various production environments and features a Dual Lane PCB Transfer System. This allows for zero PCB loading/unloading time by pre-loading the opposite lane, increasing productivity by up to 15% compared to a single lane.

Technical Specifications

Specification	Detail
Alignment	Fly Camera, Fix Camera
Spindle & Speed	2 Gantry * 10 Spindles / 80,000 CPH (Optimum)
Placement Accuracy	Chip: ±40µm @ Cpk≥1.0 (0402 chip) IC: ±30µm @ Cpk≥1.0 (Stage Vision)
Component Range	Fly: 0402 ~ □16 mm Fix: ~□42 mm (Standard) / ~□55 mm (MFOV) / ~L75 mm Connector (MFOV)
Max. Component Height	12 mm (Fly) / 25 mm (Fix)
PCB Size (Max)	Single Lane: L510 x W460 mm (Standard), up to L1,500 x W460 mm (Option) Dual Lane: L510 x W250 mm (Standard), up to L1,200 x W250 mm (Option)
Feeder Capacity	120 ea (8 mm standard) / 112 ea (Docking Cart)
Power	3 Phase, AC 200/208/220/240/380/415V ±10% (50/60Hz), Max. 5.0 kVA
Air Consumption	5.0 ~ 7.0 kgf/cm², 50 Nℓ/min
External Dimension	L 1,430 x D 1,740 x H 1,485 mm
Weight	Approx. 1,800 kg

DECAN F2 Advanced Flexible Placer