Description
Panasonic NPM-W2S — Modular Placement Machine
Designed for Versatility
The Panasonic NPM-W2S is a single-beam Surface-Mount Technology (SMT) pick-and-place platform crafted to adapt seamlessly within Panasonic’s modular manufacturing ecosystem. Whether you’re aiming to boost production or require a reliable backup machine, this line booster offers unmatched flexibility.
A Compact yet Powerful Solution
This innovative system optimizes efficiency by balancing performance and footprint. Its robust design ensures precision, making it the ideal choice for manufacturers seeking to enhance throughput without compromising quality.
Seamless Integration
Fully compatible with Panasonic’s existing modular manufacturing solutions, the NPM-W2S transforms your production line into a cohesive, high-functioning unit. Its innovative features allow it to quickly adapt to varying production demands, reinforcing its position as the go-to machine for dynamic manufacturing environments.
Highlights:
- Conventional NPM platform with one simple beam — from NPM series backup to multiple connection configurations.
- Directly connectable to NPM-W2; mutual compatibility of placement heads, nozzles, tape feeders and feeder carts with the NPM series.
- Up to 38,500 cph (0.094 s/chip) with the Lightweight 16-nozzle head; 03015/0402 ultra-small chip support.
- 3-nozzle head V2 with max. 100 N placement load for large components L 150 × W 25 × T 30 mm.
- Rear & front feeder layout, single tray layout and twin tray layout selectable.
- Automatic pick-up error recovery and inspection option before pick-up improve operation rate and quality.
Specification
| Model ID / Model No. | NPM-W2S / NM-EJM5E |
| PCB dimensions | Single-lane batch: L 750 × W 550 mm; 2-position: L 350 × W 550 mm; Dual-lane (batch): L 750 × W 260 mm; (2-position): L 350 × W 260 mm |
| Max. speed (per head) | Lightweight 16-nozzle: 38,500 cph (0.094 s/chip); 12-nozzle: 32,250 cph; Lightweight 8-nozzle: 20,800 cph; 3-nozzle V2: 8,320 cph (0.433 s/chip), 6,500 cph (0.554 s/QFP) |
| Placement accuracy (Cpk ≥ 1) | ±30 µm/chip (16nz: ±25 µm option); QFP: ±30 µm (3nz V2, under □12 mm), ±50 µm (□12–32 mm) |
| Component dimensions | 03015*/0402 chip to L 6 × 6 × 3 (16nz); 0402 to L 12 × 12 × 6.5 (12nz); 0402 to L 32 × 32 × 12 (8nz); 0603 to L 150 × 25 × 30 (3nz V2) |
| Component supply | Front/rear feeder carts: max. 120; Single tray: max. 86; Twin tray: max. 60; Stick: max. 15; Tray: max. 20–40 |
| Electric source | 3-phase AC 200–480 V, 2.0 kVA |
| Pneumatic source | 0.5 MPa, 200 L/min (A.N.R.) |
| Dimensions / Mass | W 1,280 × D 2,477 × H 1,444 mm / 2,390 kg (main body only) |
Option:
- 3-nozzle head V2 (max. placement load 100 N).
- ±25 µm placement support option; 03015 mm chip placement.
- Inspection option before pick-up; automatic pick-up error recovery.
- PIP lighting unit (insertion lead component recognition).
- Automatic teach and automatic feed recognition.
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