Description
Cutting-Edge 3D SPI Technology
The MIRTEC MS-11 is an advanced, high-performance inline 3D Solder Paste Inspection (SPI) system, specifically designed for SMT manufacturing lines. It ensures precision and accuracy in inspecting solder paste depositions on PCBs, identifying defects right after the screen-printing process.
Optimize Your SMT Process
Engineered for precision, the MIRTEC MS-11 enhances quality control by detecting irregularities in solder paste application early. This prevents costly downstream issues, ensuring seamless production and reducing wastage.
Why Choose the MIRTEC MS-11?
Reliability and accuracy define the MS-11, making it the ultimate choice for teams seeking to elevate the performance of their electronic manufacturing processes. It’s the perfect solution to consistently achieve flawless PCBs with optimal solder paste adhesion.
Key Features
- Vision System: Uses an exclusive 4MP, 10MP, or 15MP CoaXPress / ISIS digital camera technology for fast, clear image capture.
- Imaging Technology: Features Dual Projection Shadow-Free Moiré Phase Shift Imaging to prevent shadows and accurately measure shapes.
- Precision: Offers 2-micron height accuracy and a 10-micron/pixel resolution with telecentric lenses.
- Software: Uses AI-based deep learning for automated programming and optical character recognition (OCR) to reduce false failure calls.
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