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3D SPI OMRON VP9000 Series Solder Paste Inspection

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Price on request — quote within 12 working hours
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✓ Photo-verified stockInspection reportSerial-number traceableDDP available
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Description

Achieve Ultra-Precise Volume Measurements

The VP9000 is designed to deliver outstanding accuracy in PCB solder paste analysis, utilizing advanced 3D imaging technology. This state-of-the-art system ensures consistent and repeatable measurements, making it a reliable choice for professionals in the electronics industry.

Automatic Compensation for PCB Warpage

Say goodbye to measurement errors caused by warpage. The VP9000 calculates potential PCB warpage at every inspection point and applies automatic corrections before performing the analysis. This innovative feature ensures your results remain impeccable.

Highly Accurate and Dependable

With an accuracy within 2%, the VP9000 stands out in precision testing equipment. It provides comprehensive insights into solder paste volume measurements, allowing for optimal performance and quality control. Reliable, efficient, and easy-to-use, it’s a perfect addition to your toolkit.

Model:VP9000VP9000LVP9000LD
TechnologySingle or Dual Projector, True 3D SPISingle or Dual Projector, True 3D SPISingle or Dual Projector, True 3D SPI
AccuracyVolume within 2%Volume within 2%Volume within 2%
Optical Resolution25/12.5/8.5um, 20/10/7.5um, 15/7.5/5um25/12.5/8.5um, 20/10/7.5um, 15/7.5/5um25/12.5/8.5um, 20/10/7.5um, 15/7.5/5um
Board Handling50mm x 50mm, 250mm x 330mm50mm x 50mm, 460mm x 510mm50mm x 50mm, 510mm x 330mm

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