Koh Young KY8080 | High-value 3D Solder Paste Inspection

Description

Unmatched 3D Measurement Accuracy

The KY8080 redefines precision with its cutting-edge True 3D measurement technology. In the electronics manufacturing industry, solder paste printing is a critical phase that accounts for over 70% of defects in a surface mount assembly line. With the increasing complexity of components, accurate inspection has become more crucial than ever. The KY8080 ensures field-leading reliability to minimize errors and enhance productivity.

Inspection That Makes a Difference

This innovative system by Koh Young integrates proprietary 3D inspection technologies, offering unparalleled defect detection capabilities. Early identification of process defects can significantly reduce costly rework and ensure seamless operations. By incorporating the KY8080, manufacturers can stay ahead in an increasingly competitive market.

Optimized for Complex Assemblies

Modern electronics demand high standards, and the KY8080 delivers by flawlessly managing the solder paste printing process. This advanced solution is specifically engineered to handle even the smallest, most intricate components, empowering manufacturers to maintain quality while improving efficiency. With the KY8080, achieve reliability and robustness in every production line.

Key Features

Advanced True 3D Measurement Accuracy and Inspection Reliability

The printing process is an essential part of the electronics manufacturing, and it accounts for over 70% of defect generated in a surface mount assembly line. It is also one of the most important part of the SMT process. As components become smaller and more complex, it is becoming more difficult to manage the solder paste printing process. Identifying defects earlier will reduce unwanted costs in the long run.

The KY8080 reliably identifies process defects by integrating Koh Young’s propriety True 3D measurement and inspection technologies.

Ideally Blending Cost with Performance

Real-Time Warp Compensation

SPC-based Process Improvement

KSMART Solutions: True 3D Measurement-based Process Control System

The Koh Young KY8080 is a high-value, inline True 3D Solder Paste Inspection (SPI) system engineered by Koh Young Technology to detect print defects during surface-mount technology (SMT) PCB assembly.

Key Features & Capabilities

• True 3D Measurement: Utilizes patented projection and inspection technology to deliver accurate, shadow-free volumetric measurements of solder paste without false calls or PCB color sensitivity.
• Optimized Performance: Built for high-efficiency lines (such as mobile device manufacturing), offering fast inspection speeds and exceptional measurement repeatability.
• Comprehensive SPC Tools: Integrates advanced Statistical Process Control (SPC Plus) capabilities, including real-time charts, histograms, and automated reporting to monitor and optimize print quality.
• Cost-Effective Value: Positioned as an ideal blend of advanced metrology-level inspection performance and a lower initial investment/cost of ownership.