ASM SIPLACE SX series machines | SX1&SX2

Description

Modular Design for Unmatched Flexibility

The ASM SIPLACE SX Series stands out as an innovative surface mount technology (SMT) pick-and-place solution. Its modular design allows for interchangeable gantries, providing unparalleled flexibility to adapt to your production needs seamlessly.

Capacity-on-Demand Scaling

Whether you’re managing a high-mix or high-volume scenario, the SIPLACE SX Series offers a unique ‘Capacity-on-Demand’ feature, enabling you to scale up or down efficiently based on your workflow requirements. This ensures optimal resource utilization and cost-effectiveness.

Designed for High-Performance Electronics Assembly

Built to handle diverse tasks in modern electronics manufacturing, this platform delivers consistent accuracy and speed. Its intelligent design supports a variety of placements, making it ideal for complex production environments.

Highlights:

• Capacity on demand: The SIPLACE SX adapts to your manufacturing needs, simplifying all challenges
• Suitable for low, medium, and high-speed applications based on head and line configuration
• Maximum performance with industry-leading heads and wide component range for perfect line balancing
• Best placement quality with closed-loop processes, digital vision system, automated PCB warpage compensation, and linear motors for the lowest DPM rates
• The SIPLACE SX excels in handling odd-shaped components, ensuring precise and reliable placement even for the most challenging parts
• Energy-saving: E-Car-inspired power supply concept, kinetic energy recovery, and air consumption off when idle
• SIPLACE X Feeders: Accurate, intelligent, interactive, lightweight, wireless, and maintenance-free
• Faster new product introduction with self-teach and NPI capabilities, plus off-line programming for the fastest and easiest setup
• Software capabilities & IT integration: Seamlessly integrate SIPLACE software with third-party systems

Sepecification:

Option:

• CP20 Placement Head – for maximum accuracy and speed:
  – for the smallest, most sensitive components from 0201 metric to 8.2 mm × 8.2 mm and 4 mm height
  – extremely fast with up to 46,500 cph
  – extremely accurate with up to ±34 μm @ 3 σ
  – placement force from 0.5 N to 4.5 N
  – including touchless pickup and zero-force placement
• CPP Placement Head – for maximum flexibility:
  – for components from 01005 to 50 mm × 40 mm and 15.5 mm height
  – speed of up to 23,850 cph
  – accuracy of up to ±30 μm @ 3 σ
  – software-controlled switching between pick & place, collect & place, and mixed mode
  – enables a perfectly balanced line even with fast product changeovers – no time-consuming configuration or head change required
• TWIN Placement Head – for maximum force:
  – places components from 0201 metric to 200 mm × 150 mm and 25 mm height (TWIN VHF version with up to 50 mm height)
  – speed of up to 5,500 cph
  – accuracy of up to ±26 μm @ 3 σ
  – placement force from 1.0 N to 100 N (TWIN VHF version)
  – component weight up to 300 g (TWIN VHF version)
  – snap-in detection and real-time 3D measurement
• 3D Coplanarity Sensor: Detects faulty components for optimal process control
• SIPLACE MeasuringFeeder: Precise measurement and fast verification of components to avoid incorrect placements and improve process reliability
• SIPLACE Glue Feeder: Automated adhesive application for reliable component fixation and improved process reliability
• Linear Dipping Unit (LDU): Efficient dipping and placement, also suitable for small volumes and multi-die applications
• SIPLACE PowerConnector
• SIPLACE Smart Pin Support: Automated placement of support pins
• WPC5/WPC6: Non-stop supply of components in trays
• JTF-M: Flexible supply system for JEDEC trays
• LED Centering: Precise placement of LEDs
• OSC Package: Software and hardware solutions for placing large and heavy odd-shaped components
• Stationary component camera, type 53GigE & type 56GigE
• Thick Board Option: For board thicknesses up to xxx mm
• Clinching Tool for THT components
• On-board PCB Inspection: Solder paste, pre-placement and post-placement inspection for zero DPM production
• Smart Nozzle Reader: Detects smart nozzles with unique IDs for optimal process control