Modular Design for Unmatched Flexibility

The ASM SIPLACE SX Series stands out as an innovative surface mount technology (SMT) pick-and-place solution. Its modular design allows for interchangeable gantries, providing unparalleled flexibility to adapt to your production needs seamlessly.

Capacity-on-Demand Scaling

Whether you’re managing a high-mix or high-volume scenario, the SIPLACE SX Series offers a unique ‘Capacity-on-Demand’ feature, enabling you to scale up or down efficiently based on your workflow requirements. This ensures optimal resource utilization and cost-effectiveness.

Designed for High-Performance Electronics Assembly

Built to handle diverse tasks in modern electronics manufacturing, this platform delivers consistent accuracy and speed. Its intelligent design supports a variety of placements, making it ideal for complex production environments.

Highlights:

Capacity on demand: The SIPLACE SX adapts to your manufacturing needs, simplifying all challenges
Suitable for low, medium, and high-speed applications based on head and line configuration
Maximum performance with industry-leading heads and wide component range for perfect line balancing
Best placement quality with closed-loop processes, digital vision system, automated PCB warpage compensation, and linear motors for the lowest DPM rates
The SIPLACE SX excels in handling odd-shaped components, ensuring precise and reliable placement even for the most challenging parts
Energy-saving: E-Car-inspired power supply concept, kinetic energy recovery, and air consumption off when idle
SIPLACE X Feeders: Accurate, intelligent, interactive, lightweight, wireless, and maintenance-free
Faster new product introduction with self-teach and NPI capabilities, plus off-line programming for the fastest and easiest setup
Software capabilities & IT integration: Seamlessly integrate SIPLACE software with third-party systems

Sepecification:

	SIPLACE SX1	SIPLACE SX2
Placement speed	43.250 cph	86.500 cph
Placement accuracy	+/- 25µ @ 3σ
PCB dimensionen (L x W)	up to 450 mm x 560 mm single-track conveyor up to 450 mm x 265 mm dual-track conveyor up tp 1525 mm x 560 mm long board option
Feeder capacity	up to 120 x 8 mm feeder
Machine dimensions	1,5 m × 2,475 m × 1,45 m (L x W x H)

Option:

CP20 Placement Head – for maximum accuracy and speed:
– for the smallest, most sensitive components from 0201 metric to 8.2 mm × 8.2 mm and 4 mm height
– extremely fast with up to 46,500 cph
– extremely accurate with up to ±34 μm @ 3 σ
– placement force from 0.5 N to 4.5 N
– including touchless pickup and zero-force placement
CPP Placement Head – for maximum flexibility:
– for components from 01005 to 50 mm × 40 mm and 15.5 mm height
– speed of up to 23,850 cph
– accuracy of up to ±30 μm @ 3 σ
– software-controlled switching between pick & place, collect & place, and mixed mode
– enables a perfectly balanced line even with fast product changeovers – no time-consuming configuration or head change required
TWIN Placement Head – for maximum force:
– places components from 0201 metric to 200 mm × 150 mm and 25 mm height (TWIN VHF version with up to 50 mm height)
– speed of up to 5,500 cph
– accuracy of up to ±26 μm @ 3 σ
– placement force from 1.0 N to 100 N (TWIN VHF version)
– component weight up to 300 g (TWIN VHF version)
– snap-in detection and real-time 3D measurement
3D Coplanarity Sensor: Detects faulty components for optimal process control
SIPLACE MeasuringFeeder: Precise measurement and fast verification of components to avoid incorrect placements and improve process reliability
SIPLACE Glue Feeder: Automated adhesive application for reliable component fixation and improved process reliability
Linear Dipping Unit (LDU): Efficient dipping and placement, also suitable for small volumes and multi-die applications
SIPLACE PowerConnector
SIPLACE Smart Pin Support: Automated placement of support pins
WPC5/WPC6: Non-stop supply of components in trays
JTF-M: Flexible supply system for JEDEC trays
LED Centering: Precise placement of LEDs
OSC Package: Software and hardware solutions for placing large and heavy odd-shaped components
Stationary component camera, type 53GigE & type 56GigE
Thick Board Option: For board thicknesses up to xxx mm
Clinching Tool for THT components
On-board PCB Inspection: Solder paste, pre-placement and post-placement inspection for zero DPM production
Smart Nozzle Reader: Detects smart nozzles with unique IDs for optimal process control

ASM SIPLACE SX2

ASM SIPLACE SX series machines | SX1&SX2