Description
Panasonic NPM-W2 — High-speed Dual-lane Placement Machine
Efficient and Versatile PCB Assembly
The Panasonic NPM-W2 is designed for manufacturers seeking precision and speed in their PCB assembly process. This modular pick-and-place machine delivers high productivity and ensures flawless placement of even the tiniest electronic components on printed circuit boards.
Precision Engineering for Tiny Components
Engineered for accuracy, the NPM-W2 can handle miniature parts with ease, making it ideal for industries producing compact and intricate electronic devices. Its advanced technology ensures components are placed reliably every time, minimizing errors and improving output.
Modular Design for Scalability
Adaptability is a key feature of the Panasonic NPM-W2. Its modular design allows for seamless scaling to match your production needs, whether you’re working on small prototypes or ramping up to full-scale manufacturing. Experience a tailored solution that grows with your business demands.The Panasonic NPM-W2 is a high-productivity modular pick-and-place machine used to place tiny electronic parts onto printed circuit boards
Highlights:
- High-speed placement of chip components on PCBs up to 750 × 550 mm with dual-lane transfer.
- Four placement head choices: Lightweight 16-nozzle (38,500 cph), 12-nozzle, 8-nozzle and 3-nozzle head V2 (100 N placement load).
- High production mode / high-accuracy mode selectable depending on the PCB.
- Optional dispensing heads (dot 0.16 s/dot / draw) and 2D inspection heads (18 µm / 9 µm resolution) for in-line process integration.
- PCB information communication function minimizes 750 mm PCB change time; PCB standby between machines.
- Automatic support pin replacement (option) and feeder cart exchange during production.
Specification
| Model ID / Model No. | NPM-W2 / NM-EJM7D |
| PCB dimensions | Batch mounting: L 750 × W 550 mm; Dual transfer (batch): L 750 × W 260 mm; Dual transfer (2-position): L 350 × W 260 mm |
| Max. speed (per head) | Lightweight 16-nozzle: 38,500 cph (0.094 s/chip) / 35,000 cph; 12-nozzle: 32,250 / 31,250 cph; 8-nozzle: 20,800 cph; 3-nozzle V2: 8,320 cph (0.433 s/chip), 6,500 cph (0.554 s/QFP) |
| Placement accuracy (Cpk ≥ 1) | ±30 µm/chip (±25 µm option) for 16/12-nozzle (±40 µm in high production OFF); 8-nozzle: ±30 µm/QFP; 3-nozzle V2: ±30 µm/QFP |
| Component dimensions | 0402 chip to L 6 × 6 × 3 mm (16nz); 03015*/0402 to L 6 × 6 × 3 (16nz high-accuracy); 0402 to L 12 × 12 × 6.5 (12nz); 0402 to L 32 × 32 × 12 (8nz); 0603 to L 150 × 25 × 30 (3nz V2) |
| Component supply | Front/rear feeder carts: max. 120; Single tray: max. 86; Twin tray: max. 60; Stick: max. 15–30; Tray: max. 20–40 |
| Dispensing head | Dot: 0.16 s/dot (±75 µm); Draw: 4.25 s/component (±100 µm) |
| Inspection head | 2D (A): 18 µm / 2D (B): 9 µm resolution, solder + component inspection |
| Electric source | 3-phase AC 200–480 V, 2.8 kVA |
| Pneumatic source | 0.5 MPa, 200 L/min (A.N.R.) |
| Dimensions / Mass | W 1,280 × D 2,332 × H 1,444 mm / 2,470 kg (main body only) |
Option:
- Dispensing head (dot / draw) and 2D inspection heads (A) / (B).
- ±25 µm placement support option.
- 03015 mm chip placement support.
- Automatic support pin replacement; feeder cart exchange during production.
- Inspection option before pick-up.
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