Description
Innovative Design with Enhanced Features
The ISO-certified Heller 1809 MK7 reflow oven sets a new standard in reflow systems with its groundbreaking design. Responding to customer needs, it focuses on delivering lower Delta T on the board, reducing nitrogen consumption, and simplifying maintenance — a trifecta of efficiency and user-friendliness.
Compact and Production-Friendly
Featuring a low-height profile, the 1809 MK7 ensures better visibility across the production floor, making it a practical addition to any manufacturing environment. This design creates a smarter layout while maintaining top-tier performance for your reflow operations.
Customizable for Your Specific Needs
The Heller 1809 MK7 offers high customization options, including nitrogen chamber air and vacuum configurations. Tailor the system to suit your unique production requirements and achieve optimal results every time.
Highlights:
Easy to maintain
Save 10-15% in energy loss
INDUSTRY 4.0 Compatible Reflow Oven
revoluntionary green flux management system that uses catalyst that produces no waste byproduct, and allows flux removal while reflow soldering oven is running and eliminates the risk of flux clogging.
low delta T on the board
Integrated CPK software at no charge
Specifications
| Oven Length (mm) | 4660 |
| Process Gas Options | Air, Nitrogen |
| Heated Zones | 9 |
| Heated Length (Convection/Total) | 2500 |
| Cool Zones | 2 |
| Max Working Temperature | Standard: 350°C (Option: 400°C) |
| Maximum PCB Width | 55.9cm (22”) (61cm Optional) |
| Cleanroom Option | Down to Class 1000 |
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