Description
Industry-Leading True 3D Inspection Technology
The Koh Young KY8030 series, including the KY8030-3 and KY8030-2 models, is renowned as the best-selling True 3D Solder Paste Inspection (SPI) system in the market. Designed for use in Surface Mount Technology (SMT) electronics manufacturing, this innovative system delivers unparalleled precision and reliability.
Optimize Quality and Efficiency
Equipped with cutting-edge technology, the KY8030 series ensures accurate measurements and defect detection, improving the overall production quality on your SMT lines. Its advanced 3D inspection capability helps manufacturers identify potential issues early, reducing the risk of costly rework and downtime.
Trusted by Industry Professionals
With numerous satisfied users globally, the Koh Young KY8030 series stands out for its efficiency, ease of use, and exceptional performance. When precision and speed are paramount, this SPI system is the go-to choice for top-tier electronics production facilities.
The Koh Young KY8030 series (including models like the KY8030-3 and KY8030-2) is an industry-leading, best-selling True 3D Solder Paste Inspection (SPI) system used in SMT (Surface Mount Technology) electronics manufacturing lines.
Key Features & Technology
- Patented Dual-Projection: Utilizes dual-projection Moiré technology to completely eliminate critical shadow and specular reflection challenges.
- High-Speed Inspection: Delivers industry-leading speeds (up to 91.2 cm/sec on the -3 variant) to optimize mass production throughput.
- AI-Powered Optimization: Integrates with the Koh Young Process Optimizer (KPO) to dynamically adjust printer parameters and achieve zero-defect manufacturing.
- Advanced Compensation: Features Active Warp Compensation to ensure accurate measurement reliability on warped or flexible substrates.
- Metrology-Level Accuracy: Accurately measures paste height, volume, area, offsets, bridging, and coplanarity down to ultra-small components (like 03015 metrics).
Core Specifications (Typical KY8030-2/3)
- Height Resolution: 1 µm
- X-Y Resolution: 15 µm to 25 µm configurable
- Max Standard PCB Size: Up to 510 x 510 mm (with USX variants expanding single-pass capacities past 1,300 mm)
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