Description
Streamlined Efficiency for Circuit Board Assembly
The NXT III from Fuji Corporation is an advanced, high-speed pick-and-place machine tailored for surface-mount technology (SMT) circuit board assembly. Its modular design allows for seamless integration into various production setups, ensuring unmatched flexibility and productivity.
Performance-Driven and Multi-Functional
Engineered for precision, the NXT III excels in delivering fast yet accurate assembly of components, handling a variety of sizes and shapes with ease. Whether for prototyping or high-volume manufacturing, it’s equipped to support diverse production needs.
Innovative Design for Modern Manufacturing
Built with cutting-edge technology, the NXT III optimizes workflow with intuitive controls and automated functions, minimizing downtime and maximizing throughput. This state-of-the-art machine is an excellent addition to any electronics assembly line.
Highlights:
- FUJI Scalable Placement Platform, 3rd generation — overwhelming performance and scalability for all components and production styles.
- Up to 42,000 cph in productivity priority mode (H24 head, NXT IIIc); H24 head: 35,000 cph standard.
- Placement accuracy ±0.025 mm (3σ) with H24/H02F/G04F heads (high-accuracy tuning); ±0.015 mm heightened-accuracy mode on NXT IIIc.
- Wide head line-up: H24, V12, H12HS, H08M, H08, H04S(F), H04, H02(F), H01, G04(F), GL, IH — handles 03015 chips to 74 × 74 mm components.
- M3 III compact module (320 mm width, 20 feeder types) and M6 III wide module (645 mm, 45 feeder types) for optimal line configuration.
- Intelligent feeders support 4 to 104 mm tape widths; On-the-Fly no-stop production tools for element preparation, replenishment, changeover and maintenance.
Specification
| Machine | M3 III / M6 III (M3 IIIc / M6 IIIc) |
| PCB size (L × W) | M3 III: 48 × 48 to 534 × 610 mm (single) / 534 × 510 mm (dual); M6 III: 48 × 48 to 610 × 380 mm; dual conveyance (W) 280 mm or less |
| Feeder capacity | M3 III: 20 types (8 mm tape); M6 III: 45 types (8 mm tape) |
| Placement heads | H24, V12, H12HS, H08M, H08, H04S(F), H04, H02(F), H01, G04(F), GL, IH1 (M6 III adds HX, OF, IH3) |
| Throughput | H24: 35,000 cph; V12: 26,000 cph; H12HS: 24,500 cph; H08M: 13,000 cph; H08: 11,500 cph; H04SF: 10,500 cph; H04S: 9,500 cph; H04: 6,500 cph; H02F: 6,700 cph; H02: 5,500 cph; H01: 4,200 cph; G04/G04F: 7,500 cph; GL: 16,363 dph |
| Placing accuracy (3σ, Cpk ≥ 1.00) | H24 / H02F / G04F: ±0.025 (±0.034) mm; V12 / H12HS: ±0.038 (±0.050) mm; H08M / H04SF / H04S: ±0.040 mm; H08 / H04 / OF: ±0.050 mm; H02 / H01 / G04: ±0.030 mm; GL: ±0.100 mm |
| Applicable components | H24: 03015 to 5.0 × 5.0 mm; V12/H12HS: 0402 to 7.5 × 7.5 mm; H08M: 0603 to 45 × 45 mm (H 13 mm); H08: 0402 to 12 × 12 mm; H04S(F)/H04: 1608 to 38 × 38 mm; H02(F)/H01/OF: 1608 to 74 × 74 mm (32 × 180 mm); G04(F): 0402 to 15 × 15 mm |
| PCB load time | Dual conveyor: 0 s (continuous); Single conveyor: 2.5 s (M3 III) / 3.4 s (M6 III) |
| Module width | M3 III: 320 mm; M6 III: 645 mm |
| Component supply | Intelligent feeder: 4–104 mm tape; Stick feeder: 4–32 mm component width; Tray units: JEDEC 135.9 × 322.6 mm etc. |
| Power / Air | 3-phase AC 200–230 V ±10% (50/60 Hz) / 0.5 MPa (ANR) |
Option:
- Glue dispensing head GL (16,363 dph, 0.22 s/dot).
- Insertion heads IH1 / IH3 for through-hole components.
- HX head for large odd-form components; OF head for odd-form.
- Auto loading machine, dynamic no-stock feeder station, automatic splicing machine, automatic support pin setter, head/nozzle cleaning units.
- Nexim / Floor Insight production management software.
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