Description
High-Accuracy Component Placement
The Fuji NXT-H is engineered for unparalleled precision, seamlessly combining the placement of surface mount technology (SMD) components and semiconductor dies. This hybrid unit delivers outstanding accuracy, ensuring your production process meets the highest quality standards.
Streamlined Hybrid Technology
With its integrated design, the NXT-H allows you to perform SMD and semiconductor die placement tasks in a single inline system. This eliminates the need for multiple tools, boosting efficiency while reducing production complexities.
Built for Versatile Applications
Whether you’re working on advanced electronics or intricate semiconductor assemblies, the Fuji NXT-H offers the flexibility you need. Its cutting-edge technology meets the demands of modern manufacturing, ensuring a reliable and efficient workflow.
Highlights:
- Ultra-accurate placement platform combining high-speed SMD placement with semiconductor die placement technology.
- Supports panels up to 610 × 610 mm and wafers from 4 to 12 inches for batch and inline production.
- Flip Chip type FC: G04FC head, 4 nozzles, placement accuracy ±0.008 mm for face-down die placement (complex modules, multi-chip SiP).
- Small Die type SD: H24S/H24C head, 24 nozzles, 13,400 cph for wide-range high-speed die placement (face up).
- Large Die type LD: H08MQ head, 8 nozzles, 8,700 cph — handles dies up to 24 × 24 mm (IGBT / power modules, die + SMD placement).
- Up to 16 feeders for tape reels 8 to 16 mm on the fixed feeder table; supports up to 25 different wafers with flip chip and face-up supply.
- Automatic pusher pot exchange and automatic nozzle exchange reduce operator workload during production.
Specification
| Machine | NXT-H (type FC / type SD / type LD) |
| Panel size | Up to 610 × 610 mm |
| Heads | G04FC (4 nozzles, ±0.008 mm); H24S / H24C (24 nozzles, 13,400 cph); H08MQ (8 nozzles, 8,700 cph) |
| Die placement accuracy | ±0.008 mm (type FC, G04FC head) |
| Die size | Up to 24 × 24 mm (type LD) |
| Wafer support | 4 to 12 inch wafers; up to 25 different wafers; flip chip (face down) and face-up supply |
| Component supply | Up to 16 feeders (8–16 mm tape) on fixed feeder table |
| Applications | Fan-out PLP, DCB, multi-chip SiP, multi chip module, power modules, IGBT, sensor modules |
Option:
- Flip Chip type FC / Small Die type SD / Large Die type LD configurations.
- Automatic pusher pot changer (flux transfer, push-pot exchange during flip chip placement).
- Automatic nozzle changer.
- Flux transfer for high-speed placement of small parts.
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