Description
Maximize Productivity with the Panasonic NPM-D3
Designed to meet the rigorous demands of high-volume PCB assembly, the Panasonic NPM-D3 delivers unparalleled efficiency and speed. This state-of-the-art modular SMT pick-and-place machine is part of Panasonic’s innovative Smart Factory solutions, empowering manufacturers to optimize operational output and stay ahead in competitive markets.
Compact Design, Powerful Performance
Despite its compact footprint, the Panasonic NPM-D3 doesn’t compromise on performance. Its modular architecture makes it ideal for manufacturers looking to save space while achieving robust and scalable assembly operations. The machine is engineered for precision and reliability, setting a new benchmark for versatility in PCB manufacturing.
Why Choose the Panasonic NPM-D3?
The Panasonic NPM-D3 is more than just a pick-and-place machine. It offers a seamless integration into Smart Factory ecosystems, ensuring enhanced operational efficiency and minimized downtime. Whether you’re upgrading your assembly line or starting a new project, the NPM-D3 is the ideal choice for modern, high-speed production environments.
Highlights:
- High area productivity with total mounting lines; printing, placement and inspection process integration.
- Configurable modules allow flexible line setup; head location flexibility with plug-and-play functions.
- Five placement head choices including Lightweight 16-nozzle head (42,000 cph), 12-/8-nozzle, 2-nozzle, dispensing head and 2D inspection heads.
- Optional 2D inspection heads (A: 18 µm / B: 9 µm resolution) perform solder inspection and component inspection in-line.
- Comprehensive control of lines, floor and factory with Panasonic system software.
- Slim 832 mm body width enables compact line layouts.
Specification
| Model ID / Model No. | NPM-D3 / NM-EJM6D |
| PCB dimensions | Dual-lane: L 510 × W 300 mm; Single-lane: L 510 × W 590 mm |
| Max. speed (per head) | Lightweight 16-nozzle: 42,000 cph (0.086 s/chip); 12-nozzle: 34,500 cph; 8-nozzle: 21,500 cph; 2-nozzle: 5,500 cph (0.655 s/chip) |
| Placement accuracy (Cpk 1) | ±30 µm/chip (±25 µm option); 16-nozzle head: ±40 µm/chip; QFP: ±30 µm (12–32 mm) / ±50 µm (under 12 mm) |
| Component dimensions | 03015*/0402 chip to L 6 × W 6 × T 3 mm (16nz); 0402 to L 12 × 12 × 6.5 (12nz); to L 32 × 32 × 12 (8nz); 0603 to L 100 × 90 × 28 (2nz) |
| PCB exchange time | Dual-lane: 0 s*; Single-lane: 3.6 s (short conveyor) |
| Component supply | Taping: max. 68 feeders (4/8 mm, small reel); Stick: max. 16; Tray: max. 20 per tray feeder |
| Dispensing head | Dot: 0.16 s/dot (±75 µm); Draw: 4.25 s/component (±100 µm) |
| Inspection head | 2D (A): 18 µm resolution, solder 0.35 s/view, component 0.5 s/view; 2D (B): 9 µm resolution |
| Electric source | 3-phase AC 200–480 V, 2.7 kVA |
| Pneumatic source | 0.5 MPa, 100 L/min (A.N.R.) |
| Dimensions / Mass | W 832 × D 2,652 × H 1,444 mm / 1,680 kg (main body only) |
Option:
- Dispensing head (dot / draw dispensing).
- 2D inspection head (A) and (B) for solder / component inspection.
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