Description
Revolutionizing High-Mix Production
The Panasonic AM100 is a cutting-edge SMT (Surface Mount Technology) pick and place machine, designed to meet the demands of high-mix, variable-volume production environments. Its modular design ensures seamless adaptability, making it an invaluable asset for fast-paced assembly lines.
Exceptional Flexibility and Modular Design
Engineered with flexibility in mind, the AM100 supports a wide range of component types, enabling manufacturers to handle diverse production requirements. The machine’s modular build allows for quick adjustments and upgrades, ensuring sustained performance as demands evolve.
Streamlined Changeovers
Fast and efficient product changeovers are at the core of the AM100’s design. This feature not only minimizes downtime but also maximizes productivity in variable-volume production settings, making it an indispensable solution for modern manufacturing needs.
Highlights:
- Modular placement machine with a wide variety of machine layouts and options for an optimum line suitable for all types of production.
- APC (Advanced Process Control) system: feedforward of solder-position offset values to placement heads improves mounting quality.
- Placement height control based on PCB warpage data and individual part thickness improves mounting quality.
- Automatic support pin replacement reduces labor and operator errors during changeover.
- Component Verification option prevents setup errors by verifying production data and component barcode data (wired or wireless scanner).
- Mounting MES software PanaCIM-EE Gen2 improves total factory productivity and quality (material management, traceability, operation analysis).
- Supports 0402 chip placement and components up to L 120 × W 90 mm or L 150 × W 25 mm.
Specification
| Model ID / Model No. | AM100 / NM-EJM4D |
| PCB dimensions | L 50 × W 50 mm to L 510 × W 460 mm |
| Placement speed | 35,800 cph (0.1006 s/chip); 12,200 cph (0.295 s/QFP, □12 mm or less) |
| Placement accuracy (Cpk ≥ 1) | ±40 µm/chip; ±50 µm/QFP (□12 mm or less); ±30 µm/QFP (□12 mm over to □32 mm or less) |
| Component dimensions | 0402 chip* to L 120 × W 90 mm or L 150 × W 25 mm (T = 28 mm*) |
| PCB exchange time | 4.0 s (no component on rear side of PCB) |
| Component supply | Taping: max. 160 tape feeders (4/8 mm, small reel) / tray feeder max. 120; Stick: max. 40; Tray: max. 20–30 |
| Tape width | 4 to 56 / 72 / 88 / 104 mm |
| Electric source | 3-phase AC 200/220 V ±10 V, AC 380/400/420/480 V ±20 V, 2.0 kVA |
| Pneumatic source | Min. 0.5 MPa to max. 0.8 MPa, 200 L/min (A.N.R.) |
| Dimensions (W × D × H) | 1,970 × 2,019 × 1,500 mm |
| Mass | 2,650 kg (main body only) |
Option:
- Component Verification option (prevents component setup errors, array data activesync, interlock and navigation functions).
- PCB warpage measurement and placement height control.
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