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TRI TR7007 Series | 3D SPI TR7007 SII Plus&TR7007 SIII&TR7007Q / Q Plus / QI Plus&TR7007D / DI Plus&TR7007Q SII-S & SII Ultra

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Description

The TRI TR7007 Series is your go-to solution for precision in 3D Solder Paste Inspection (SPI). Designed by Test Research, Inc. (TRI), these state-of-the-art systems are tailored to enhance Surface Mount Technology (SMT) and semiconductor manufacturing lines.

Innovative 3D Solder Paste Inspection

Featuring advanced technology, the TRI TR7007 Series delivers highly accurate and reliable solder paste measurements. These systems empower manufacturers to maintain high production standards, reducing defects and improving overall yield.

Optimized for SMT and Semiconductor Applications

Built for versatility, the TRI TR7007 Series integrates seamlessly into SMT and semiconductor production lines. With its intelligent design, it provides comprehensive inspection capabilities that meet the ever-evolving demands of modern electronics manufacturing.

Why Choose the TRI TR7007 Series?

If you’re looking for cutting-edge automation and unrivaled performance in SPI systems, the TRI TR7007 Series is an ideal choice. Experience unparalleled efficiency, precise results, and a trusted brand at the forefront of technological innovation.

Key Features and Capabilities

  • High-Speed Inspection: Achieves industry-leading inspection speeds up to 200 cm²sec using dynamic imaging technology.
  • Shadow-Free 3D Metrology: Uses multiple digital projectors (up to 4 depending on the model) for accurate, shadow-free height and volume measurements.
  • Advanced Defect Detection: Identifies insufficient or excessive paste, shape anomalies, offsets, and low solder paste bridges under 30 µm.
  • Warp Compensation: Automatically compensates for local PCB deformation and board warpage.
  • Smart Factory Integration: Supports Industry 4.0 standards like IPC-CFX, IPC Hermes 9852, and closed-loop feedback/feed-forward with printers.

 

Common TR7007 Models

  • TR7007 SII Plus: High-speed inline 3D SPI optimized for standard SMT manufacturing lines.
  • TR7007 SIII: Enhanced mechanical platform built for high stability and precision at peak speeds.
  • TR7007Q / Q Plus / QI Plus: High-resolution configurations featuring up to 4 projectors for complex components.
  • TR7007D / DI Plus: Dual-projector platforms designed for seamless shadow-free inspection.
  • TR7007Q SII-S & SII Ultra: Specialized high-resolution models designed for advanced packaging, Mini-LED, and SEMI back-end applications.

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