Description
Unmatched Efficiency for PCB Assembly
The BTU Pyramax 150N Z12 is a cutting-edge nitrogen (N2) convection reflow soldering oven, tailored for high-throughput PCB assembly. Whether you’re tackling complex or high-volume production, this oven ensures precise, reliable results every time.
Optimized for Lead-Free Processes
Designed specifically to meet the demands of modern lead-free soldering techniques, the Pyramax 150N Z12 offers industry-leading thermal performance. Its nitrogen reflow capability reduces oxidation and enhances solder joint quality, ideal for advanced electronics manufacturing.
Elevate Your Production Quality
Combining superior accuracy with low maintenance, this reflow oven is an indispensable asset for achieving streamlined production and optimal soldering outcomes. Invest in the BTU Pyramax 150N Z12 to stay ahead in PCB technology.
BTU Pyramax 150N Z12 Key Specifications
- Heating Zones: 12 top and 12 bottom heated zones
- Cooling Zones: 2 top and 2 bottom cooling zones
- Total Length: 6.474 mm (approx. 6.47 meters)
- Heating Length: 3.810 mm
- Cooling Length: 1.168 mm
- Max Temperature: 350°C standard (optional 400°C)
- Atmosphere: Nitrogen (N₂) or Air configuration options
- Electrical Requirements: Typically 480Y/277VAC, 133A, 3-phase, 50/60 Hz (varies by specific facility hookup)
Core Features
- Closed-Loop Convection Control: Provides precise programmable heat transfer, constant convection, and reduced nitrogen consumption.
- WINCON Control System: Features an intuitive software interface with advanced analytical capabilities and board-level traceability options.
- Flux Management System: Built-in mechanism to capture and manage flux residues for lower maintenance.
Automation: Supports automatic rail width adjustment and SMEMA smart product tracking.
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